Electronic component

ABSTRACT

An electronic component includes a multilayer body including dielectric layers, a circuit pattern, and band-shaped conductor patterns. The circuit pattern includes a conductor pattern that is disposed inside the multilayer body and defines an inductor. The band-shaped conductor patterns are grounded and cover a portion of a shield surface. An internal surface is located between the circuit pattern and an upper surface. On a shield surface, a non-shielded area is provided which is not covered with any of the band-shaped conductor patterns, and through which magnetic flux generated from the inductor is able to pass.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of priority to Japanese PatentApplication No. 2016-176944 filed on Sep. 9, 2016 and is a ContinuationApplication of PCT Application No. PCT/JP2017/026771 filed on Jul. 25,2017. The entire contents of each of these applications are herebyincorporated herein by reference.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to electronic components including shieldelectrodes.

2. Description of the Related Art

Electronic components of an integrated circuit are disposed close toeach other on a substrate in many cases. Accordingly, in a case in whichnoise generated inside the electronic component leaks to the outside,the noise may have an unfavorable influence on other electroniccomponents near the noise-source electronic component.

In order to prevent such a situation, a shield electrode is formed on asurface of an electronic component in some cases, as in the case of ashield-type lamination electronic component that is disclosed inJapanese Unexamined Patent Application Publication No. 9-121093.

Noise from the inside or the outside of an electronic component isguided to a ground electrode through a shield electrode. In anelectronic component provided with a shield electrode, it is possible toreduce or prevent a situation in which noise enters from the outside,and to reduce or prevent the leakage of magnetic flux to the outside ofthe electronic component. This type of effect provided by the shieldelectrode is also referred to as a “shielding effect” hereinafter.

In a case in which an inductor (coil) is formed inside an electroniccomponent, as in a lamination-type low pass filter, for example,magnetic flux is generated from the inductor when a current flowsthrough the inductor. In a case in which this magnetic flux is blockedby one shield electrode that covers substantially the whole area of eachof the component surfaces as described in Japanese Unexamined PatentApplication Publication No. 9-121093, an eddy current is generated inthe shield electrode so that the insertion loss of the electroniccomponent increases, which may cause a Q value of the electroniccomponent to deteriorate. As described above, since the shielding effectand the Q value have a trade-off relationship, it is necessary toappropriately balance the shielding effect and the Q value.

SUMMARY OF THE INVENTION

Preferred embodiments of the present invention reduce or prevent adecrease in Q value while providing the shielding effect.

An electronic component according to a preferred embodiment of thepresent invention includes a multilayer body including a plurality ofdielectric layers. The electronic component includes a circuit patternand a plurality of band-shaped conductor patterns. The circuit patternincludes a conductor pattern that is disposed inside the multilayer bodyand defines an inductor. The plurality of band-shaped conductor patternsare grounded. The electronic component includes an upper surface, alower surface, a side surface, and an internal surface. The lowersurface opposes the upper surface. The side surface connects the uppersurface and the lower surface. The internal surface is located betweenthe circuit pattern and the upper surface and is parallel orsubstantially parallel to the upper surface. The plurality ofband-shaped conductor patterns cover a portion of a shield surface. Theshield surface includes at least one of the upper surface, the sidesurface, and the internal surface. On the shield surface, a non-shieldedarea is provided which is not covered with any of the plurality ofband-shaped conductor patterns, and through which magnetic fluxgenerated from the inductor is able to pass.

An electronic component according to a preferred embodiment of thepresent invention includes a multilayer body including a plurality ofdielectric layers. The electronic component includes a circuit patternand a partial shield portion. The circuit pattern includes a conductorpattern that is disposed inside the multilayer body and defines aninductor. The inductor is wound around a winding axis. The partialshield portion is grounded. The electronic component includes an uppersurface, a lower surface, a side surface, and an internal surface. Thelower surface opposes the upper surface. The side surface connects theupper surface and the lower surface. The internal surface is locatedbetween the circuit pattern and the upper surface and is parallel orsubstantially parallel to the upper surface. The partial shield portioncovers a portion of a shield surface. The shield surface includes atleast one of the upper surface, the side surface, and the internalsurface. On the shield surface, a non-shielded area is provided that isnot covered with the partial shield portion. The non-shielded areaoverlaps with a portion of an air-core section of the inductor in a planview from a direction of the winding axis of the inductor.

In an electronic component according to a preferred embodiment of thepresent invention, by disposing a plurality of band-shaped conductorpatterns, as shield electrodes, on a shield surface, a non-shielded areathat is not covered with the plurality of band-shaped conductor patternsis provided on the shield surface. Accordingly, it is possible toprovide an area that blocks and an area that does not block the magneticflux generated from an inductor inside the electronic component invarious shapes on the shield surface. With the electronic component, itis possible to easily perform balance adjustment to reduce or prevent adecrease in Q value while providing the shielding effect.

In an electronic component according to a preferred embodiment of thepresent invention, in a plan view from the direction of a winding axisof an inductor, a non-shielded area overlaps with a portion of anair-core section of the inductor. Accordingly, the Q value of theelectronic component is prevented from deteriorating significantly dueto the entire area of the inductor air-core section overlapping with ashield electrode. This makes it possible to reduce or prevent a decreasein Q value while improving the shielding effect in a directionperpendicular or substantially perpendicular to the winding axis of theinductor.

With an electronic component according to a preferred embodiment of thepresent invention, it is possible to reduce or prevent the decrease inthe Q value while ensuring the shielding effect of the electroniccomponent.

The above and other elements, features, steps, characteristics andadvantages of the present invention will become more apparent from thefollowing detailed description of the preferred embodiments withreference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a circuit diagram of a low pass filter 1 as an example of anelectronic component according to a first preferred embodiment of thepresent invention.

FIG. 2 is an external appearance perspective view of the low pass filterin FIG. 1.

FIG. 3 is an external appearance see-through view of the low pass filterin FIG. 1.

FIG. 4 is an exploded perspective view illustrating a laminationstructure of the low pass filter in FIG. 1.

FIGS. 5A and 5B include diagrams schematically depicting magnetic fluxgenerated from an inductor.

FIGS. 6A to 6C show simulation results each depicting a state in whichmagnetic flux from the inside of a low pass filter leaks to the outside.

FIG. 7 is a diagram illustrating a see-through view of the low passfilter in FIG. 2 in a plan view from a winding axis direction(lamination direction) of an inductor.

FIG. 8 is a diagram for explaining an example of a path from a groundelectrode to another ground electrode in a low pass filter.

FIG. 9 is a diagram illustrating a see-through view of a low pass filteras an example of an electronic component according to a Modification 1of the first preferred embodiment, in a plan view from a winding axisdirection (lamination direction) of an inductor.

FIG. 10 is a diagram for explaining an example of a path from a groundelectrode to an open end of a band-shaped conductor pattern in a lowpass filter as an example of an electronic component according to aModification 2 of the first preferred embodiment of the presentinvention.

FIG. 11 is an external appearance perspective view of a low pass filteras an example of an electronic component according to a Modification 3of the first preferred embodiment of the present invention.

FIG. 12 is an external appearance perspective view of a low pass filteras an example of an electronic component according to a Modification 4of the first preferred embodiment of the present invention.

FIG. 13 is an external appearance perspective view of a low pass filteras an example of an electronic component according to a Modification 5of the first preferred embodiment of the present invention.

FIG. 14 is an external appearance perspective view of a low pass filteras an example of an electronic component according to a Modification 6of the first preferred embodiment of the present invention.

FIG. 15 is an external appearance perspective view of a low pass filteras an example of an electronic component according to a Modification 7of the first preferred embodiment of the present invention.

FIG. 16 is an external appearance perspective view of a low pass filteras an example of an electronic component according to a Modification 8of the first preferred embodiment of the present invention.

FIG. 17 is an external appearance perspective view of a low pass filteras an example of an electronic component according to a Modification 9of the first preferred embodiment of the present invention.

FIG. 18 is a circuit diagram of a band pass filter as an example of anelectronic component according to a second preferred embodiment of thepresent invention.

FIG. 19 is an external appearance perspective view of a band pass filteras an example of an electronic component according to the secondpreferred embodiment of the present invention.

FIG. 20 is an external appearance see-through view of the band passfilter in FIG. 19.

FIG. 21 is an exploded perspective view illustrating a laminationstructure of the band pass filter in FIG. 19.

FIG. 22 is an external appearance perspective view of a low pass filteras an example of an electronic component according to a third preferredembodiment of the present invention.

FIG. 23 is a diagram illustrating a see-through view of the low passfilter in FIG. 22 in a plan view from a winding axis direction(lamination direction) of an inductor.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, preferred embodiments of the present invention will bedescribed in detail with reference to the accompanying drawings. Notethat the same or corresponding elements are assigned the same referencesigns in the drawings, and description thereof will not be repeated.

First Preferred Embodiment

FIG. 1 is a circuit diagram of a low pass filter 1 as an example of anelectronic component according to a first preferred embodiment of thepresent invention. The low pass filter 1 is an electronic componentmounted on a circuit board, and a circuit pattern corresponding to thecircuit illustrated in FIG. 1 is provided inside the low pass filter 1.As illustrated in FIG. 1, the low pass filter 1 includes an input-outputterminal P1, an input-output terminal P2, an LC parallel resonator LC1,and an LC series resonator LC2.

The LC parallel resonator LC1 includes an inductor L1 and a capacitorC1. The inductor L1 is connected between the input-output terminal P1and the input-output terminal P2. The capacitor C1 is connected inparallel to the inductor L1, between the input-output terminal P1 andthe input-output terminal P2.

The LC series resonator LC2 includes an inductor L2, a capacitor C2, anda capacitor C3. One end of the inductor L2 is connected to a groundpoint GND. The capacitor C2 is connected between the input-outputterminal P1 and the other end of the inductor L2. The capacitor C3 isconnected between the input-output terminal P2 and the other end of theinductor L2.

FIG. 2 is an external appearance perspective view of the low pass filter1 in FIG. 1. FIG. 3 is an external appearance see-through view of thelow pass filter 1 in FIG. 1. In FIG. 3, a circuit pattern providedinside the low pass filter 1 is not illustrated in order to prevent thedrawing from being complicated. As will be explained later withreference to FIG. 4, the low pass filter 1 is a multilayer body in whicha plurality of dielectric layers Lyr1 to Lyr14 are laminated in a Z-axisdirection (lamination direction).

As illustrated in FIG. 2 and FIG. 3, the low pass filter preferably has,for example, a rectangular or substantially rectangular parallelepipedshape. Surfaces of the outermost layers perpendicular or substantiallyperpendicular to the lamination direction of the low pass filter 1 arerespectively referred to as a lower surface BF and an upper surface UF.The lower surface BF opposes the upper surface UF. Of the surfacesparallel or substantially parallel to the lamination direction, surfacesparallel or substantially parallel to a Z-X plane are defined as sidesurfaces SF1 and SF3. Of the surfaces parallel or substantially parallelto the lamination direction, surfaces parallel or substantially parallelto a Y-Z plane are defined as side surfaces SF2 and SF4. The sidesurfaces SF1 to SF4 connect the upper surface UF and the lower surfaceBF.

On the lower surface BF, the input-output terminals P1 and P2, and theground electrodes GND1 to GND4 are provided. The input-output terminalsP1 and P2, and the ground electrodes GND1 to GND4 are preferably, forexample, land grid array (LGA) terminals defined by planar electrodesthat are regularly disposed on the lower surface BF. The low pass filter1 is mounted on a circuit board (not illustrated) in a state in whichthe lower surface BF opposes the circuit board.

A direction identification mark DM is provided on the upper surface UF.The direction identification mark DM is disposed to identify thedirection of the low pass filter 1 at the mounting time.

An internal surface DF is a surface at which the dielectric layer Lyr14of the uppermost layer and the dielectric layer Lyr13 of the secondlayer from the top make contact with each other. On the side surfacesSF1 to SF4 and the internal surface DF, a plurality of band-shapedconductor patterns BP11 to BP14, BP21, BP22, BP31 to BP34, BP41, BP42,and BP131 to BP134 are disposed in a lattice configuration to defineshield electrodes. The side surfaces SF1 to SF4 and the internal surfaceDF correspond to shield surfaces. The shield electrode is not providedon the side surfaces of the dielectric layer Lyr1 including the lowersurface BF and the side surfaces of the dielectric layer Lyr14 includingthe upper surface UF.

With the shield electrode, a situation in which noise from the outsideenters into the low pass filter is able to be reduced or prevented and asituation in which magnetic flux radiated from the circuit pattern leaksto the outside is also able to be reduced or prevented. The magneticflux generated from the inductors L1 and L2 provided inside the low passfilter 1 is able to pass through an area (non-shielded area) that is notcovered with any of the band-shaped conductor patterns.

In the first preferred embodiment, the non-shielded area is provided onthe internal surface DF defining a shield surface that is seen in a planview from the winding axis direction of the inductor L1 (Z-axisdirection), and is also provided on the side surfaces SF1 to SF4defining shield surfaces that are seen in plan views from directionsperpendicular or substantially perpendicular to the winding axis of theinductor L1 (an X-axis direction and a Y-axis direction).

The band-shaped conductor patterns BP11 to BP14 are disposed on the sidesurface SF1. The band-shaped conductor pattern BP11 extends in theX-axis direction. The band-shaped conductor patterns BP12 to BP14 arespaced away from each other in the X-axis direction. Each of theband-shaped conductor patterns BP12 to BP14 extends in the Z-axisdirection. Each of the band-shaped conductor patterns BP12 to BP14preferably defines a cross shape with the band-shaped conductor patternBP11 in a plan view from the Y-axis direction. The band-shaped conductorpattern BP12 is connected to the ground electrode GND1 via a lineconductor pattern 21 and a via conductor pattern V21.

On the side surface SF2, the band-shaped conductor patterns BP21 andBP22 are provided. The band-shaped conductor pattern BP21 extends in theY-axis direction and is connected to the band-shaped conductor patternBP11. The band-shaped conductor pattern BP22 extends in the Z-axisdirection. In a plan view from the X-axis direction, the band-shapedconductor pattern BP22 preferably defines a cross shape with theband-shaped conductor pattern BP21.

The band-shaped conductor patterns BP31 to BP34 are disposed on the sidesurface SF3. The band-shaped conductor pattern BP31 extends in theX-axis direction and is connected to the band-shaped conductor patternBP21. The band-shaped conductor patterns BP32 to BP34 are spaced awayfrom each other in the X-axis direction. Each of the band-shapedconductor patterns BP32 to BP34 extends in the Z-axis direction. Each ofthe band-shaped conductor patterns BP32 to BP34 preferably defines across shape with the band-shaped conductor pattern BP31 in a plan viewfrom the Y-axis direction. The band-shaped conductor pattern BP34 isconnected to the ground electrode GND4 via a line conductor pattern 22and a via conductor pattern V22.

On the side surface SF4, the band-shaped conductor patterns BP41 andBP42 are disposed. The band-shaped conductor pattern BP41 extends in theY-axis direction and is connected to the band-shaped conductor patternsBP11 and BP31. The band-shaped conductor pattern BP42 extends in theZ-axis direction. The band-shaped conductor pattern BP42 preferablydefines a cross shape with the band-shaped conductor pattern BP41.

The band-shaped conductor patterns BP131 to BP134 are disposed on theinternal surface DF. The band-shaped conductor pattern BP131 extends inthe X-axis direction and is connected to the band-shaped conductorpatterns BP22 and BP42. Each of the band-shaped conductor patterns BP132to BP134 extends in the Y-axis direction. Each of the band-shapedconductor patterns BP132 to BP134 preferably defines a cross shape withthe band-shaped conductor pattern BP131. The band-shaped conductorpattern BP132 is connected to the band-shaped conductor patterns BP12and BP32. The band-shaped conductor pattern BP133 is connected to theband-shaped conductor patterns BP13 and BP33. The band-shaped conductorpattern BP134 is connected to the band-shaped conductor patterns BP14and BP34.

FIG. 4 is an exploded perspective view illustrating a laminationstructure of the low pass filter 1 in FIG. 1. The low pass filter 1 is amultilayer body including a plurality of dielectric layers. The low passfilter 1 includes the dielectric layers Lyr1 to Lyr14 as the pluralityof dielectric layers. The dielectric layers are laminated in order inthe z-axis direction so that the dielectric layer Lyr1 is disposed onthe lower surface BF side and the dielectric layer Lyr14 is disposed onthe upper surface UF side. A dielectric constant of each of thedielectric layers Lyr1 to Lyr14 is identical or substantially identicalso as to facilitate the design and manufacture of the low pass filter 1.

As discussed above, the input-output terminals P1 and P2, and the groundelectrodes GND1 to GND4 are provided on the lower surface BF of thedielectric layer Lyr1.

On the dielectric layer Lyr2, the line conductor pattern and the lineconductor pattern 22 are provided. The line conductor pattern 21 isconnected to the ground electrode GND1 by the via conductor pattern V21.The line conductor pattern 22 is connected to the ground electrode GND4by the via conductor pattern V22.

On the dielectric layer Lyr3, line conductor patterns 31 to 33 areprovided. The line conductor pattern 31 is connected to the input-outputterminal P1 by a via conductor pattern V31. The line conductor pattern32 is connected to the ground electrode GND2 by a via conductor patternV32. The line conductor pattern 33 is connected to the input-outputterminal P2 by a via conductor pattern V33. The line conductor pattern32 defines the inductor L2. The inductor L2 is wound around the windingaxis parallel or substantially parallel to the lamination direction.

A capacitor conductor pattern 41 is provided on the dielectric layerLyr4. The capacitor conductor pattern 41 is connected to the lineconductor pattern 32 by a via conductor pattern V41.

Capacitor conductor patterns 51 and 52 are provided on the dielectriclayer Lyr5. The capacitor conductor pattern 51 is connected to the lineconductor pattern 31 by a via conductor pattern V51. The capacitorconductor pattern 52 is connected to the line conductor pattern 33 by avia conductor pattern V52.

In a plan view from the lamination direction, each of the capacitorconductor patterns 51 and 52 overlaps with the capacitor conductorpattern 41. The capacitor conductor patterns 41 and 51 define thecapacitor C2. The capacitor conductor patterns 41 and 52 define thecapacitor C3.

A capacitor conductor pattern 61 is provided on the dielectric layerLyr6. Capacitor conductor patterns 71 and 72 are provided on thedielectric layer Lyr7. The capacitor conductor pattern 71 is connectedto the capacitor conductor pattern 51 by the via conductor pattern V51.The capacitor conductor pattern 72 is connected to the capacitorconductor pattern 52 by the via conductor pattern V52. A capacitorconductor pattern 81 is provided on the dielectric layer Lyr8.

In a plan view from the lamination direction, each of the capacitorconductor patterns 71 and 72 overlaps with the capacitor conductorpattern 61. In the plan view from the lamination direction, thecapacitor conductor pattern 81 overlaps with the capacitor conductorpatterns 71 and 72. The capacitor conductor patterns 61, 71, 72, and 81define the capacitor C1.

A line conductor pattern 91 is provided on the dielectric layer Lyr9.The line conductor pattern 91 is connected to the capacitor conductorpattern 71 by the via conductor pattern V51. A line conductor pattern101 is provided on the dielectric layer Lyr10. The line conductorpattern 101 is connected to the line conductor pattern 91 by the viaconductor pattern V51 and a via conductor pattern V61.

A line conductor pattern 111 is provided on the dielectric layer Lyr11.The line conductor pattern 111 is connected to the line conductorpattern 101 by the via conductor pattern V61. The line conductor pattern111 is connected to the capacitor conductor pattern 72 by the viaconductor pattern V52.

A line conductor pattern 121 is provided on the dielectric layer Lyr12.The line conductor pattern 121 is connected to the line conductorpattern 111 by the via conductor patterns V52 and V61. The lineconductor patterns 91, 101, 111 and 121 define the inductor L1. Theinductor L1 is wound around the winding axis parallel or substantiallyparallel to the lamination direction.

The circuit patterns corresponding to the circuit illustrated in FIG. 1are provided on the dielectric layers Lyr1 to Lyr12.

As described earlier, the band-shaped conductor patterns BP131 to BP134are provided on the internal surface DF of the dielectric layer Lyr13.The internal surface DF is located between the upper surface UF and thecircuit pattern, and is parallel or substantially parallel to the uppersurface UF.

As described above, the direction identification mark DM is provided onthe upper surface UF of the dielectric layer Lyr14.

FIGS. 5A and 5B include diagrams schematically depicting the magneticflux generated from the inductor L1. In FIGS. 5A and 5B, in order toclearly depict a state in which the magnetic flux is generated from theinductor L1, the shield electrode is not illustrated, and only the lineconductor pattern 121 of the inductor L1 among the circuit patterns isillustrated. FIG. 5A is an external appearance perspective view of thelow pass filter 1. FIG. 5B is a plan view of the low pass filter 1 inthe Y-axis direction.

The lower surface of the electronic component is connected to a circuitboard in close contact with the circuit board. Because of this, themagnetic flux from the inside of the electronic component is likely toleak to the outside through a surface other than the lower surface. Inaddition, noise from the outside of the electronic component is likelyto enter the inside thereof through a surface other than the lowersurface. As depicted in FIGS. 5A and 5B, in the low pass filter 1, themagnetic flux is likely to leak to the outside through the upper surfaceUF perpendicular or substantially perpendicular to the winding axis ofthe inductor L1 and through the side surfaces SF1 to SF4 that areparallel or substantially parallel to the winding axis. As such, bydisposing the shield electrode on the upper surface UF or the internalsurface between the upper surface UF and the circuit pattern, and theside surfaces SF1 to SF4, it is possible to reduce or prevent theleakage of the magnetic flux from the low pass filter 1 to the outside.In addition, with the shield electrode, it is possible to reduce orprevent a situation in which noise enters into the inside of the lowpass filter 1 from the outside.

To reduce the influence of the noise from the outside on the electroniccomponent and on electronic components of other devices, it ispreferable to cover as large an area as possible with the shieldelectrode. However, when the magnetic flux from the inductor L1 isblocked by the shield electrode, an eddy current is generated in theshield electrode and the insertion loss of the low pass filter 1 isincreased, so that the Q value of the low pass filter 1 deteriorates.This may degrade the characteristics of the low pass filter 1. Asdescribed above, since the shielding effect and the Q value have atrade-off relationship, it is necessary to appropriately balance theshielding effect and the Q value.

In the first preferred embodiment, a plurality of band-shaped conductorpatterns are provided in a lattice configuration, as shield electrodes,on the internal surface DF and on each of the side surfaces SF1 to SF4.On the internal surface DF and each of the side surface SF1 to SF4, anon-shielded area is provided which is not covered with any shieldelectrode, and through which the magnetic flux from the inductor insidethe low pass filter 1 is able to pass. Due to the non-shielded areabeing provided, a situation in which the magnetic flux is blocked by theshield electrode is reduced or prevented as compared with a case inwhich the entire area of the shield surface is covered with the shieldelectrode. As a result, it is possible to obtain the balance between theshielding effect and the Q value, and to reduce or prevent the decreasein the Q value while ensuring the shielding effect.

FIGS. 6A to 6C show simulation results each depicting a state in whichmagnetic flux from the inside of a low pass filter leaks to the outside.In each of the diagrams in FIGS. 6A to 6C, a state in which magneticflux leaks to the outside is depicted with regard to one side surfaceparallel or substantially parallel to the Y-Z plane. FIG. 6A is asimulation result of a low pass filter 10 as an example of an electroniccomponent according to a Comparative Example 1. In the low pass filter10, the entire area of the surfaces other than the lower surface iscovered with a shield electrode. FIG. 6B is a simulation result of thelow pass filter 1 in FIG. 2. FIG. 6C is a simulation result of a lowpass filter 100 as an example of an electronic component according to aComparative Example 2. In the low pass filter 100, a shield electrode isnot disposed on each surface. Inside the low pass filters 10 and 100,circuit patterns similar to those of the low pass filter 1, asillustrated in FIG. 4, are provided.

When the sizes of the areas covered with the shield electrodes of thelow pass filter 1, the low pass filter 10, and the low pass filter 100are compared, the size becomes smaller in the order of the low passfilter 10, the low pass filter 1, and the low pass filter 100. As thearea covered with the shield electrode becomes smaller, the amount ofmagnetic flux that leaks to the outside becomes larger.

As depicted in FIGS. 6(a) to 6(c), magnetic flux MF10, magnetic fluxMF1, and magnetic flux MF 100 leak to the outside from the low passfilter 10, the low pass filter 1 and the low pass filter 100,respectively. The amount of magnetic flux that leaks to the outsideincreases in the order of the low pass filter 10, the low pass filter 1,and the low pass filter 100 (magnetic flux MF10<magnetic fluxMF1<magnetic flux MF100).

On the other hand, as the area covered with the shield electrode becomessmaller, an eddy current generated in the shield electrode becomessmaller. As the eddy current decreases, the insertion loss decreasesaccordingly so that a Q value becomes higher. Accordingly, when the Qvalues are compared, the value becomes higher in the order of the lowpass filter 10, the low pass filter 1, and the low pass filter 100.

In the low pass filter 1, both of the Q value and the amount of magneticflux leaking to the outside have intermediate values between those ofthe low pass filter 10 and the low pass filter 100. The low pass filter1 is able to balance the shielding effect and the Q value, and is ableto reduce or prevent the decrease in the Q value while ensuring theshielding effect.

The magnetic flux from the inductor is concentrated in the air-coresection of the inductor. Because of this, in the case in which theair-core section of the inductor is closed by the shield electrode in aplan view of the inductor from the winding axis direction (thelamination direction in the first preferred embodiment), a large eddycurrent is generated in the shield electrode, and the Q value issignificantly lowered in some case. Accordingly, in the case in whichthe leakage of magnetic flux in the winding axis direction of theinductor is allowed to some extent, it is possible to effectively reduceor prevent the decrease in the Q value by reducing the shield electrodethat overlaps with the air-core section of the inductor to decrease anunnecessary shielding effect.

FIG. 7 is a diagram illustrating a see-through view of the low passfilter 1 in FIG. 2 in a plan view from the winding axis direction(lamination direction) of the inductor L1. As illustrated in FIG. 7, inthe low pass filter 1, a portion of an air-core section AC1 of theinductor L1 overlaps with a non-shielded area that is not covered withthe band-shaped conductor patterns BP131 to BP134. In the firstpreferred embodiment, in the case in which the leakage of magnetic fluxin the winding axis direction of the inductor L1 is allowed to someextent, it is possible to effectively reduce or prevent the decrease inthe Q value.

Noise from the inside or the outside of the electronic component isguided to the ground electrode through the shield electrode. In a casein which a plurality of ground electrodes are provided, if the length ofa path from a certain ground electrode to another ground electrode isequal or substantially equal to half of an effective wavelength ofassumed noise (e.g., noise having a frequency of about 6 GHz), thestated path may act as a loop antenna so that the noise may be taken in.The effective wavelength of noise has a value obtained by dividing awavelength of the noise (for example, about 5 cm in the case of afrequency being about 6 GHz) by a dielectric constant of the dielectriclayer. Then, in the low pass filter 1, in order to prevent a path fromthe ground electrode GND1 to the ground electrode GND4 from acting as aloop antenna, the size of the low pass filter 1, and the configurationand length of the plurality of band-shaped conductor patterns arepreferably designed so that the length of the path is, for example,smaller than about half of the effective wavelength of the assumednoise.

FIG. 8 is a diagram in which one of the paths from the ground electrodeGND1 to the ground electrode GND4 is highlighted and illustrated in thelow pass filter 1. In the low pass filter 1, the size of the low passfilter 1, and the configuration and length of the plurality ofband-shaped conductor patterns are preferably designed so that thelength of the longest path from the ground electrode GND1 to the groundelectrode GND4 is preferably smaller than about half of the effectivewavelength of the assumed noise. Because of this, the path from theground electrode GND1 to the ground electrode GND4 is reduced orprevented from acting as a loop antenna. As a result, a situation inwhich the path from the ground electrode GND1 to the ground electrodeGND4 acts as an antenna so that the noise is taken in, is able to bereduced or prevented.

As described thus far, in the first preferred embodiment, by providingband-shaped conductor patterns as shield electrodes in a latticeconfiguration, non-shielded areas are provided on the shield surfaces.By appropriately selecting the configuration of the band-shapedconductor patterns, it is possible to balance the shielding effect andthe Q value, and to reduce or prevent the decrease in the Q value whileensuring the shielding effect.

Further, in the first preferred embodiment, in a plan view from thewinding axis direction of the inductor, the plurality of band-shapedconductor patterns do not cover the entire area of the air-core sectionof the inductor. A portion of the air-core section overlaps with thenon-shielded area. According to the first preferred embodiment, sincethe leakage of magnetic flux in the winding axis direction of theinductor is allowed to some extent, the decrease in the Q value is ableto be reduced or prevented.

Further, in the first preferred embodiment, the length of a path from acertain ground electrode to another ground electrode is preferably setto be, for example, smaller than about half of the effective wavelengthof assumed noise. With this, the stated path is prevented from acting asa loop antenna. As a result, it is possible to prevent noise from beingtaken in by the path.

From the standpoint of reducing or preventing a decrease in Q value, itis preferable that the entire or substantially the entire area of theair-core section of the inductor does not overlap with the shieldelectrode but overlaps with the non-shielded area. FIG. 9 is a diagramillustrating a see-through view of a low pass filter 1A as an example ofan electronic component according to a Modification 1 of the firstpreferred embodiment, in a plan view from the winding axis direction(lamination direction) of the inductor L1. As illustrated in FIG. 9, theair-core section AC1 of the inductor L1 does not overlap withband-shaped conductor patterns BP131A to BP136A disposed on the internalsurface DF, and the entire or substantially the entire area of theair-core section AC1 overlaps with the non-shielded area. According tothe Modification 1 of the first preferred embodiment, it is possible tofurther reduce or prevent the decrease in the Q value due to themagnetic flux being blocked by the shield electrode disposed on thesurface parallel or substantially parallel to the winding axis of theinductor.

In a case in which there is only one ground electrode to which each ofthe band-shaped electrode patterns is connected, if the length of a pathfrom the ground electrode to an open end (open stub) of the band-shapedconductor pattern is equal or substantially equal to a quarter of theeffective wavelength of assumed noise, the stated path may act as adipole antenna so that the noise may be taken in. Therefore, it ispreferable that the length of the longest path from the ground electrodeto the open end (open stub) of the band-shaped conductor pattern is, forexample, smaller than about a quarter of the effective wavelength of theassumed noise.

FIG. 10 is a diagram in which one of the paths from a ground electrodeto an open end of a band-shaped conductor pattern is highlighted andillustrated, in a low pass filter 1B as an example of an electroniccomponent according to a Modification 2 of the first preferredembodiment. In the low pass filter 1B, unlike the low pass filter 1, theband-shaped conductor pattern BP14 is not connected to the groundelectrode GND1. In the low pass filter 1B, each of the band-shapedconductor patterns is connected to the ground electrode GND4.

FIG. 10 illustrates a path from the ground electrode GND4 to an open endof the band-shaped conductor pattern BP12 via the band-shaped conductorpatterns BP41, BP21 and BP11. In the low pass filter 1B, in order toprevent the above path from acting as a dipole antenna, the size of thelow pass filter 1B, and the configuration and length of the plurality ofband-shaped conductor patterns are preferably designed so that thelength of the path is, for example, smaller than about a quarter of theeffective wavelength of the assumed noise. As a result, it is possibleto prevent the noise from being taken in by the path from the groundelectrode to the open end of the band-shaped conductor pattern.

In the first preferred embodiment, the plurality of band-shapedconductor patterns are disposed on the internal surface DF locatedbetween the upper surface UF and the circuit pattern. The plurality ofband-shaped conductor patterns may not be disposed on the internalsurface DF, but may be disposed on the upper surface UF.

FIG. 11 is an external appearance perspective view of a low pass filter1C as an example of an electronic component according to a Modification3 of the first preferred embodiment. As illustrated in FIG. 11,band-shaped conductor patterns BP141 to BP144 and a directionidentification mark DM1C are provided on an upper surface UF of the lowpass filter 1C. The band-shaped conductor pattern BP141 extends in theX-axis direction. The band-shaped conductor patterns BP142 to BP144 arespaced away from each other in the X-axis direction. Each of theband-shaped conductor patterns BP142 to BP144 extends in the Y-axisdirection. Each of the band-shaped conductor patterns BP142 to BP144defines a cross shape with the band-shaped conductor pattern BP141 in aplan view from the Z-axis direction. The band-shaped conductor patternBP142 is connected to the band-shaped conductor pattern BP12 via a viaconductor pattern V131 and a line conductor pattern 131 inside the lowpass filter 1C. The band-shaped conductor pattern BP144 is connected tothe band-shaped conductor pattern BP34 via a via conductor pattern V132and a line conductor pattern 132 inside the low pass filter 1C. Thedirection identification mark DM1C is so disposed so as not to overlapwith the band-shaped conductor patterns BP141 to BP144.

As in the low pass filter 1C, the plurality of band-shaped conductorpatterns may be disposed on the upper surface UF. By disposing theplurality of band-shaped conductor patterns on the upper surface UF, adistance between the dielectric layer on which the circuit pattern isprovided and the shield surface perpendicular or substantiallyperpendicular to the lamination direction are able to be larger thanthat in the case in which the plurality of band-shaped conductorpatterns are disposed on the internal surface DF. As a result, it ispossible to further reduce or prevent the decrease in the Q value of theelectronic component.

In the first preferred embodiment, the plurality of band-shapedconductor patterns are disposed on both of the side surfaces SF1 to SF4and the internal surface DF, and the non-shielded area is provided oneach of the surfaces other than the lower surface BF. It is notnecessary that the non-shielded area is provided on each of the surfacesother than the lower surface BF. That is, it is sufficient that theplurality of band-shaped conductor patterns are disposed on any of thesurfaces other than the lower surface BF, and the non-shielded area isprovided on such surfaces.

For example, as in a low pass filter 1D illustrated in FIG. 12, aplurality of band-shaped conductor patterns are disposed in a latticeconfiguration on the side surfaces SF1 to SF4 and non-shielded areas areprovided thereon. On the other hand, the entire or substantially theentire area of the upper surface UF may be covered with a shieldelectrode SE, and a non-shielded area may not be provided on the uppersurface UF. It is assumed that the low pass filter 1D is disposed closeto other electronic components located in the Z-axis direction, forexample, and it is necessary to reduce or prevent the entering of noisefrom the Z-axis direction or the leakage of magnetic flux as required asmuch as possible. Therefore, the entire or substantially the entire areaof the upper surface UF may preferably be covered with the shieldelectrode SE.

Further, as in a low pass filter 1E illustrated in FIG. 13, a pluralityof band-shaped conductor patterns are disposed in a latticeconfiguration on the upper surface UF and non-shielded areas areprovided thereon. On the other hand, the side surfaces SF1 to SF4 mayrespectively be covered with shield electrodes SE1 to SE4, and nonon-shielded area may be provided on any of the side surfaces SF1 toSF4. It is assumed that the low pass filter 1E is disposed close toother electronic components located in the X-axis direction and theY-axis direction, for example, and it is necessary to reduce or preventthe entering of noise from the X-axis direction and Y-axis direction orthe leakage of magnetic flux as required as much as possible. Therefore,the entire or substantially the entire area of each of the side surfacesSF1 to SF4 is covered with the shield electrodes SE1 to SE4,respectively.

In the first preferred embodiment, the plurality of band-shapedconductor patterns are disposed in a lattice configuration. In addition,the plurality of band-shaped conductor patterns are disposed on theshield surface in parallel or substantially in parallel to the sides ofthe electronic component. Further, the directions in which theband-shaped conductor patterns extend on the shield surface are dividedinto two directions, and the two directions are orthogonal orsubstantially orthogonal to each other. The configuration of theplurality of band-shaped conductor patterns is not limited to theconfiguration illustrated in the first preferred embodiment. Theconfiguration of the plurality of band-shaped conductor patterns may beany configuration as long as a non-shielded area is provided on thesurface other than the lower surface.

For example, as in a low pass filter 1F illustrated in FIG. 14, aplurality of band-shaped conductor patterns may be disposed in parallelor substantially in parallel (stripe shaped) and spaced away from eachother.

In the low pass filter 1, the plurality of band-shaped conductorpatterns is disposed in a lattice configuration, so that the band-shapedconductor patterns intersect with each other. As a result, the pluralityof band-shaped conductor patterns are connected on the shield surface,and the ground electrode is able to be shared. In the case in which theplurality of band-shaped conductor patterns are disposed in a stripeconfiguration as in the low pass filter 1F, the band-shaped conductorpatterns do not intersect with each other on the shield surface. Fromthe viewpoint of sharing the ground electrode, it is preferable toprovide a conductor pattern that connects the plurality of band-shapedconductor patterns inside the electronic component.

Alternatively, as in a low pass filter 1G illustrated in FIG. 15, aplurality of band-shaped conductor patterns may be disposed on theshield surfaces obliquely with respect to sides of the low pass filter1G.

Further, as in a low pass filter 1H illustrated in FIG. 16, thedirections in which a plurality of band-shaped conductor patternsextends on the shield surface may be divided into three directions, andneed not be orthogonal or substantially orthogonal to each other. Thedirections in which the plurality of band-shaped conductor patternsextend on the shield surface may be divided into four or moredirections.

In the first preferred embodiment, the electronic component preferablyhaving a rectangular or substantially rectangular parallelepiped shapeis described. The shape of an electronic component according topreferred embodiments of the present invention is not limited to arectangular or substantially rectangular parallelepiped shape. The shapeof an electronic component according to preferred embodiments of thepresent invention may have a cylindrical shape, such as a low passfilter 1J illustrated in FIG. 17, for example.

In the first preferred embodiment, in order to facilitate the design andmanufacture of the electronic component, each of the plurality ofdielectric layers preferably has the same dielectric constant. However,each of the plurality of dielectric layers need not have the samedielectric constant.

In the first preferred embodiment, the magnetic flux from the inductorL1 passes through the dielectric layer Lyr13, then passes through theband-shaped conductor pattern disposed on the internal surface DF, andis guided to the ground electrode. Therefore, the effective wavelengthof the magnetic flux passing through the above band-shaped conductorpattern has a value obtained by dividing the wavelength of the magneticflux by the dielectric constant of the dielectric layer Lyr13. Then, bymaking the dielectric constant of the dielectric layer Lyr13 smallerthan that of each of the dielectric layers Lyr1 to Lyr12 in the firstpreferred embodiment, the effective wavelength of the magnetic fluxpassing through the band-shaped conductor pattern disposed on theinternal surface DF is able to be made larger than that of the firstpreferred embodiment. Accordingly, by reducing the dielectric constantof the dielectric layer Lyr13 without changing the size of the low passfilter, the length of the path including the band-shaped conductorpattern disposed on the internal surface DF is able to be made smallerthan about half of or about a quarter of the effective wavelength. As aresult, it is possible to prevent the path from acting as an antenna.

According to Modifications 1 to 10 of the first preferred embodiment, itis possible to reduce or prevent the decrease in the Q value whileensuring the shielding effect.

Second Preferred Embodiment

In the first preferred embodiment, the winding axis of the inductorinside the electronic component is parallel or substantially parallel tothe lamination direction. In a second preferred embodiment, a case inwhich a winding axis of an inductor inside an electronic component isperpendicular or substantially perpendicular to the lamination directionwill be described.

FIG. 18 is a circuit diagram of a band pass filter 2 as an example of anelectronic component according to a second preferred embodiment of thepresent invention. The band pass filter 2 is an electronic componentthat is mounted on a circuit board and includes a circuit patterncorresponding to the circuit illustrated in FIG. 18 therein.

As illustrated in FIG. 18, the band pass filter 2 includes aninput-output terminal P21, an input-output terminal P22, an LC parallelresonator LC21, an LC parallel resonator LC22, an LC parallel resonatorLC23 and a capacitor C33.

The LC parallel resonator LC21 includes an inductor L21 and a capacitorC21. The inductor L21 and the capacitor C21 are connected in parallelbetween the input-output terminal P21 and a ground point GND.

The LC parallel resonator LC23 includes an inductor L23 and a capacitorC23. The inductor L23 and the capacitor C23 are connected in parallelbetween the input-output terminal P22 and the ground point GND.

The LC parallel resonator LC22 includes an inductor L22 and a capacitorC22. The inductor L22 is connected to the capacitor C22. The inductorL22 and the capacitor C22 are connected to the ground point GND.

The capacitor C33 is connected between the input-output terminals P21and P22.

Inductive coupling (magnetic coupling) M1 is generated between the LCparallel resonators LC21 and LC22 adjacent to each other. Inductivecoupling M2 is generated between the LC parallel resonators LC22 andLC23 adjacent to each other.

FIG. 19 is an external appearance perspective view of the band passfilter 2 as an example of an electronic component according to thesecond preferred embodiment. FIG. 20 is an external appearancesee-through view of the band pass filter 2 in FIG. 19. In FIG. 20, acircuit pattern provided inside the band pass filter 2 is notillustrated in order to prevent the drawing from being complicated. Aswill be explained below with reference to FIG. 21, the band pass filter2 is a multilayer body in which a plurality of dielectric layers Lyr21to Lyr29 are laminated in the Z-axis direction (lamination direction).

Referring to FIG. 19 and FIG. 20, the band pass filter preferably has,for example, a rectangular or substantially rectangular parallelepipedshape. Surfaces of the band pass filter 2 perpendicular or substantiallyperpendicular to the lamination direction are respectively referred toas a lower surface BF2 and an upper surface UF2. Of the surfacesparallel or substantially parallel to the lamination direction, surfacesparallel or substantially parallel to the Z-X plane are defined as sidesurfaces SF21 and SF23. Of the surfaces parallel to the laminationdirection, surfaces parallel or substantially parallel to the Y-Z planeare defined as side surfaces SF22 and SF24.

On the lower surface BF2, the input-output terminals P21 and P22, andground electrodes GND21 to GND24 are provided. The input-outputterminals P21 and P22, and the ground electrodes GND21 to GRD24 arepreferably, for example, LGA terminals defined by planar electrodes thatare regularly disposed on the lower surface BF2. The lower surface BF2is connected to a circuit board.

A direction identification mark DM2 is provided on the upper surfaceUF2. The direction identification mark DM2 is used to identify thedirection of the band pass filter 2 at the mounting time.

BP11B to BP14B are disposed on the side surface SF21. BP21B to BP24B aredisposed on the side surface SF22. BP31B to BP34B are disposed on theside surface SF23. BP41B to BP44B are disposed on the side surface SF24.BP281 to BP284 are disposed on an internal surface DF2. The internalsurface DF2 is a surface at which the dielectric layer Lyr28 makescontact with the dielectric layer Lyr29. The side surfaces SF21 to SF24and the internal surface DF2 correspond to shield surfaces. No shieldelectrode is provided on the side surfaces of the dielectric layer Lyr21including the lower surface BF2 and the dielectric layer Lyr29 includingthe upper surface UF2.

The band-shaped conductor patterns BP11B to BP14B are disposed on theside surface SF21. The band-shaped conductor pattern BP11B extends inthe X-axis direction. The band-shaped conductor patterns BP12B to BP14Bare spaced away from each other in the X-axis direction. Each of theband-shaped conductor patterns BP12B to BP14B extends in the Z-axisdirection. Each of the band-shaped conductor patterns BP12B to BP14Bdefines a cross shape with the band-shaped conductor pattern BP11B in aplan view from the Y-axis direction.

The band-shaped conductor patterns BP21B to BP24B are disposed on theside surface SF22. The band-shaped conductor patterns BP21B and BP23Bextend in the Z-axis direction. The band-shaped conductor pattern BP21Bis connected to the band-shaped conductor pattern BP11B. The band-shapedconductor patterns BP22B and BP24B extend in the Y-axis direction.

An area surrounded by the band-shaped conductor patterns BP21B to BP24Bis a non-shielded area preferably having a rectangular or substantiallyrectangular shape, for example. By disposing the band-shaped conductorpatterns BP21B to BP24B in this manner, in a plan view from the X-axisdirection (a winding axis direction of the inductors L21 to L23 to beexplained below), the band-shaped conductor patterns BP21B to BP24B donot overlap with an air-core section of each of the inductors L21 to L23provided inside the band pass filter 2.

The band-shaped conductor patterns BP31B to BP34B are disposed on theside surface SF23. The band-shaped conductor pattern BP31B extends inthe X-axis direction and is connected to the band-shaped conductorpattern BP23B. The band-shaped conductor patterns BP32B to BP34B arespaced away from each other in the X-axis direction. Each of theband-shaped conductor patterns BP32B to BP34B extends in the Z-axisdirection. Each of the band-shaped conductor patterns BP32B to BP34Bdefines a cross shape with the band-shaped conductor pattern BP31B,respectively. The band-shaped conductor pattern BP34B is connected tothe ground electrode GND24 via a line conductor pattern 222 and a viaconductor pattern V222 provided inside the band pass filter.

The band-shaped conductor patterns BP41B to BP44B are disposed on theside surface SF24. The band-shaped conductor patterns BP41B and BP43Bextend in the Z-axis direction. The band-shaped conductor pattern BP41Bis connected to the band-shaped conductor pattern BP11B. The band-shapedconductor pattern BP43B is connected to the band-shaped conductorpattern BP31B. The band-shaped conductor patterns BP42B and BP44B extendin the Y-axis direction.

An area surrounded by the band-shaped conductor patterns BP41B to BP44Bis a non-shielded area preferably having a rectangular or substantiallyrectangular shape, for example. By disposing the band-shaped conductorpatterns BP41B to BP44B in this manner, in a plan view from the X-axisdirection (the winding axis direction of the inductors L21 to L23 to beexplained later), the band-shaped conductor patterns BP41B to BP44B donot overlap with the air-core section of each of the inductors L21 toL23 provided inside the band pass filter 2.

The band-shaped conductor patterns BP281 to BP284 are disposed on theinternal surface DF2. The band-shaped conductor pattern BP281 extends inthe X-axis direction and is connected to the band-shaped conductorpatterns BP24B and BP44B. Each of the band-shaped conductor patternsBP282 to BP284 extends in the Y-axis direction. Each of the band-shapedconductor patterns BP282 to BP284 defines a cross shape with theband-shaped conductor pattern BP281. The band-shaped conductor patternBP282 is connected to the band-shaped conductor patterns BP12B andBP32B. The band-shaped conductor pattern BP283 is connected to theband-shaped conductor patterns BP13B and BP33B. The band-shapedconductor pattern BP284 is connected to the band-shaped conductorpatterns BP14B and BP34B.

FIG. 21 is an exploded perspective view illustrating a laminationstructure of the band pass filter 2 in FIG. 19. The band pass filter 2includes the dielectric layers Lyr21 to Lyr29. The dielectric layers arelaminated in order in the z-axis direction so that the dielectric layerLyr21 is disposed on the lower surface BF2 side and the dielectric layerLyr29 is disposed on the upper surface UF2 side.

As described above, the input-output terminals P21 and P22, and theground electrodes GND21 to GND24 are provided on the lower surface BF2of the dielectric layer Lyr21.

On the dielectric layer Lyr22, a line conductor pattern 221 and the lineconductor pattern 222 are provided. The line conductor pattern 221 isconnected to the input-output terminal P21 by a via conductor patternV221. The line conductor pattern 222 is connected to the groundelectrode GND24 by the via conductor pattern V222.

A capacitor conductor pattern 231 is provided on the dielectric layerLyr23.

Capacitor conductor patterns 241 and 242 are provided on the dielectriclayer Lyr24. The capacitor conductor pattern 241 is connected to theline conductor pattern 221 by a via conductor pattern V241. Thecapacitor conductor pattern 242 is connected to the input-outputterminal P22 by a via conductor pattern V242.

Each of the capacitor conductor patterns 241 and 242 overlaps with thecapacitor conductor pattern 231 in a plan view from the laminationdirection. The capacitor conductor patterns 231, 241 and 242 define thecapacitor C33.

A capacitor conductor pattern 251 is provided on the dielectric layerLyr25. The capacitor conductor pattern 251 overlaps with the capacitorconductor patterns 241 and 242 in a plan view from the laminationdirection. The capacitor conductor patterns 241 and 251 define thecapacitor C21. The capacitor conductor patterns 242 and 251 define thecapacitor C23.

A capacitor conductor pattern 261 is provided on the dielectric layerLyr26. The capacitor conductor pattern 261 overlaps with the capacitorconductor pattern 251 in the plan view from the lamination direction.The capacitor conductor patterns 251 and 261 define the capacitor C22.

On the dielectric layer Lyr27, line conductor patterns 271 to 273 areprovided. The line conductor pattern 271 is connected to the capacitorconductor pattern 241 by the via conductor pattern V241. The lineconductor pattern 271 is connected to the capacitor conductor pattern251 by a via conductor pattern V271. The line conductor pattern 271 andthe via conductor patterns V241 and V271 define the inductor L21. Theinductor L21 is wound around the winding axis perpendicular orsubstantially perpendicular to the lamination direction.

The line conductor pattern 272 is connected to the capacitor conductorpattern 251 by a via conductor pattern V272. The line conductor pattern272 is connected to the capacitor conductor pattern 261 by a viaconductor pattern V273. The line conductor pattern 272 and the viaconductor patterns V272 and V273 define the inductor L22. The inductorL22 is wound around the winding axis perpendicular or substantiallyperpendicular to the lamination direction.

The line conductor pattern 273 is connected to the capacitor conductorpattern 242 by the via conductor pattern V242. The line conductorpattern 273 is connected to the capacitor conductor pattern 251 by a viaconductor pattern V274. The line conductor pattern 273 and the viaconductor patterns V242 and V274 define the inductor L23. The inductorL23 is wound around the winding axis perpendicular or substantiallyperpendicular to the lamination direction.

As described above, the band-shaped conductor patterns BP281 to BP284are provided on the internal surface DF2 of the Lyr28. The internalsurface DF2 is located between the upper surface UF2 and the circuitpattern.

As described above, the direction identification mark DM2 is provided onthe Lyr29.

In a plan view from the winding axis direction of the inductors L21 toL23, the entire or substantially the entire area of the air-core sectionof each of the inductors L21 to L23 overlaps with the non-shielded area,respectively.

As described above, in the second preferred embodiment, the plurality ofband-shaped conductor patterns are provided as shield electrodes, todefine the non-shielded areas on the shield surfaces. With thisstructure, it is possible to obtain the balance between the shieldingeffect and the Q value, and to reduce or prevent the decrease in the Qvalue while securing the shielding effect.

Further, in the second preferred embodiment, since the entire orsubstantially the entire area of the air-core section of the inductoroverlaps with the non-shielded area in a plan view from the winding axisdirection of the inductor, it is possible to further reduce or prevent adecrease in Q value due to the magnetic flux being blocked by the shieldelectrode disposed on the surface parallel or substantially parallel tothe winding axis of the inductor.

Third Preferred Embodiment

In the first preferred embodiment and the second preferred embodiment, acase in which a plurality of band-shaped conductor patterns are disposedon shield surfaces so as to define non-shielded areas is provided. Thenon-shielded area may be provided without using a plurality ofband-shaped conductor patterns. In a third preferred embodiment, a casewill be described in which a plurality of holes are provided in a planarshield electrode so as to define a non-shielded area.

A third preferred embodiment of the present invention differs from thefirst preferred embodiment in that a plurality of holes are provided ina planar shield electrode so as to define a non-shielded area. Since theremaining configuration is the same as or similar to that of the firstpreferred embodiment, description thereof will not be repeated.

FIG. 22 is an external appearance perspective view of a low pass filter3 as an example of an electronic component according to the thirdpreferred embodiment. As illustrated in FIG. 22, shield electrodes SE1and SE4 are disposed on side surfaces SF1 and SF4 of the low pass filter3, respectively. Although not illustrated in the drawing, shieldelectrodes SE2 and SE3 are disposed on side surfaces SF2 and SF3,respectively. The entire or substantially the entire area of each of theside surfaces SF1 to SF4 is covered with the shield electrodes SE1 toSE4.

On an upper surface UF, a shield electrode PSE is disposed. PorositiesH1 to H5 are provided in the shield electrode PSE. Each of the areas inwhich the porosities H1 to H5 are provided in the upper surface UF is anon-shielded area. The shield electrode PSE corresponds to a partialshield portion.

FIG. 23 is a diagram illustrating a see-through view of the low passfilter 3 in FIG. 22 in a plan view from a winding axis direction(lamination direction) of an inductor L1. As illustrated in FIG. 23, inthe low pass filter 3, an air-core section AC1 of the inductor L1overlaps with a non-shielded area surrounded by the porosity H3.

As described above, in the third preferred embodiment, by providing aporosity in a shield electrode, a non-shielded area surrounded by theporosity is provided in a shield surface. As a result, it is possible toobtain the balance between the shielding effect and the Q value, and toreduce or prevent the decrease in the Q value while ensuring theshielding effect.

Further, according to the third preferred embodiment, since the positionand size of the porosities is able to be adjusted flexibly in accordancewith a circuit pattern of the electronic component, non-shielded areasare able to be provided in accordance with the circuit pattern, ascompared with the first preferred embodiment in which non-shielded areasare defined by band-shaped conductor patterns.

Moreover, according to the third preferred embodiment, since the leakageof magnetic flux in the winding axis direction of the inductor isallowed to some extent, the decrease in the Q value is able to bereduced or prevented.

While preferred embodiments of the present invention have been describedabove, it is to be understood that variations and modifications will beapparent to those skilled in the art without departing from the scopeand spirit of the present invention. The scope of the present invention,therefore, is to be determined solely by the following claims.

What is claimed is:
 1. An electronic component comprising: a multilayerbody including a plurality of dielectric layers; a circuit patterndisposed inside the multilayer body and including a conductor patterndefining an inductor; and a plurality of band-shaped conductor patternsthat are grounded; wherein the multilayer body includes an uppersurface, a lower surface opposing the upper surface, a side surfaceconnecting the upper surface and the lower surface, and an internalsurface located between the circuit pattern and the upper surface andparallel or substantially parallel to the upper surface; the pluralityof band-shaped conductor patterns cover a portion of the multilayer bodyto define a shield surface including at least one of the upper surface,the side surface, and the internal surface; the plurality of band-shapedconductor patterns include a first band-shaped conductor patternextending in a first direction and a second band-shaped conductorpattern extending in a second direction different from the firstdirection; and a non-shielded area is provided on the shield surfacewhich is not covered with any of the plurality of band-shaped conductorpatterns, and through which magnetic flux generated from the inductor isable to pass.
 2. The electronic component according to claim 1, whereinthe first direction and the second direction are orthogonal orsubstantially orthogonal to each other.
 3. The electronic componentaccording to claim 1, wherein the inductor is wound around a windingaxis; the shield surface is perpendicular or substantially perpendicularto the winding axis; and at least a portion of an area of an air-coresection of the inductor overlaps with the non-shielded area in a planview from a direction of the winding axis.
 4. The electronic componentaccording to claim 3, wherein an entire or substantially an entire areaof the air-core section overlaps with the non-shielded area in the planview from the direction of the winding axis.
 5. The electronic componentaccording to claim 3, wherein the winding axis is parallel orsubstantially parallel to a lamination direction of the plurality ofdielectric layers.
 6. The electronic component according to claim 1,wherein the shield surface includes the upper surface.
 7. The electroniccomponent according to claim 1, wherein the shield surface includes theinternal surface.
 8. The electronic component according to claim 3,wherein the winding axis is perpendicular or substantially perpendicularto a lamination direction of the plurality of dielectric layers.
 9. Theelectronic component according to claim 1, wherein the shield surfaceincludes the side surface.
 10. The electronic component according toclaim 1, further comprising: a plurality of ground electrodes disposedon the lower surface; wherein each of the plurality of dielectric layershas the same dielectric constant; each of the plurality of band-shapedconductor patterns is connected to any of the plurality of groundelectrodes; the plurality of ground electrodes include a first groundelectrode and a second ground electrode; and a distance of a path fromthe first ground electrode to the second ground electrode via theplurality of band-shaped conductor patterns is smaller than about halfof an effective wavelength obtained by dividing a wavelength of assumednoise by the dielectric constant.
 11. The electronic component accordingto claim 1, further comprising: a ground electrode disposed on the lowersurface; wherein each of the plurality of dielectric layers has the samedielectric constant; each of the plurality of band-shaped conductorpatterns is connected to the ground electrode; and a distance of a pathfrom the ground electrode to an open end of the plurality of band-shapedconductor patterns via the plurality of band-shaped conductor patternsis smaller than about a quarter of an effective wavelength obtained bydividing a wavelength of an assumed noise by the dielectric constant.12. The electronic component according to claim 1, wherein the shieldsurface includes at least one of the upper surface and the internalsurface; the plurality of dielectric layers includes a first dielectriclayer including the shield surface and a second dielectric layer onwhich the conductor pattern is provided; and a dielectric constant ofthe first dielectric layer is smaller than a dielectric constant of thesecond dielectric layer.